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Newswire & Press Release / Imec Demonstrates Die-to-Wafer Hybrid Bonding with A Cu Interconnect Pad Pitch of 2µm - Electronics / Instrumentation / RFID - Imec

Newswire & Press Release / Imec Demonstrates Die-to-Wafer Hybrid Bonding with A Cu Interconnect Pad Pitch of 2µm - Electronics / Instrumentation / RFID - Imec
newswiretoday.com - get the latest breaking news, showbiz & celebrity photos, sport news & rumours, viral videos and top stories from newswiretoday.com Daily Mail and Mail on Sunday newspapers.

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Imec develops die-to-wafer bond process with 2µm pad pitch

Imec develops die-to-wafer bond process with 2µm pad pitch
electronicsweekly.com - get the latest breaking news, showbiz & celebrity photos, sport news & rumours, viral videos and top stories from electronicsweekly.com Daily Mail and Mail on Sunday newspapers.

Van Campenhout , Eric Beyne ,

Imec demonstrates die-to-wafer hybrid bonding with a Cu interconnect pad pitch of 2µm

Imec demonstrates die-to-wafer hybrid bonding with a Cu interconnect pad pitch of 2µm
eejournal.com - get the latest breaking news, showbiz & celebrity photos, sport news & rumours, viral videos and top stories from eejournal.com Daily Mail and Mail on Sunday newspapers.

Joris Van Campenhout , Eric Beyne , Technology Conference ,

Backside Power Delivery by imec

Backside Power Delivery is seen as one of the most important technologies for future IC process improvements. Intel says it will introduce the technology ....

Eric Beyne , Naoto Horiguchi ,

Imec's backside power delivery for logic

Imec has presented an experimental demonstration of a routing scheme for logic ICs with backside power delivery enabled through nano-through-silicon-vias ( ....

Naoto Horiguchi , Eric Beyne , Device Technology , System Integration ,