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Automotive smart camera development with open platform turnkey solutions


Automotive smart camera development with open platform turnkey solutions
Renesas Electronics Corporation and LUPA-Electronics GmbH have announced the EagleCAM module, an open front camera solution, highlighting Renesas’ R-Car V3H and R-Car V3M SoC devices. The all-in-one, scalable camera platform is aimed at the latest Euro NCAP and C-NCAP demands, such as automatic emergency braking, forward collision warning, lane-keeping assist, and traffic sign recognition. The jointly-developed solutions allow OEMs and Tier 1s to differentiate and increase their offering by combining their proprietary or third-party software that adds further driving features.
Most smart camera turnkey solutions take a black box solution approach, making it challenging for OEMs and Tier 1s to meet evolving market demands and slowing down development. With the module, the companies offer an open turnkey solution that provides flexible, high-performance perception while reducing time to market and red ....

Naoki Yoshida , Automotive Digital Products Marketing Division , Renesas Electronics Corporation , Electronics Gmbh , Renesasr Car Socs , Automotive Solution Business Unit , Benjamin May , R Car Socs , தானியங்கி டிஜிட்டல் ப்ராடக்ட்ஸ் சந்தைப்படுத்தல் பிரிவு , மின்னணுவியல் கஂப் , தானியங்கி தீர்வு வணிக அலகு , பெஞ்சமின் இருக்கலாம் ,

SiC Based Power Electronics & Inverter Market to Hit USD 3,888.2 million by 2027; Advancements in Semiconductor Technologies to Propel the Market: Fortune Business Insights™


SiC Based Power Electronics & Inverter Market to Hit USD 3,888.2 million by 2027; Advancements in Semiconductor Technologies to Propel the Market: Fortune Business Insights™
List of Key Players Covered in this Market Report: Methode Electronics, Inc. (United States), Toshiba Corporation (Japan), Maxim Integrated Products, Inc. (United States), Rockwell Automation Inc. (United States), Fuji Electric Co, Ltd. (Japan), ABB Group (Switzerland), Infineon Technologies AG (Germany), STMicroelectronics (Switzerland), ON Semiconductor (United States), Microsemi Corporation (United States), Texas Instruments Incorporated (United States), Semikron Electronics GmbH & Co., Inc. (United States), Mitsubishi Electric Corp (Japan), Renesas Electronics Corporation (Japan), NXP Semiconductor N.V. (The Netherlands), ROHM CO., LTD. (Japan), Cree, Inc. (United States) ....

United States , United Kingdom , Cross Timber , Asia Pacific , Generation Sic Electronics To Boost The Market , Railway Shipbuilding , Industry Development , Renesas Electronics Corporation Japan , Maxim Integrated Products Inc , Microsemi Corporation United States , Rockwell Automation Inc , Toshiba Corporation Japan , Aerospace Defense , Cree Inc , Mitsubishi Electric Corp Japan , Porter Five Forces Analysis , Fuji Electric Co Ltd , Electrical Electronics , Semikron Electronics Gmbh Co Inc , Group Switzerland , Methode Electronics Inc , Infineon Technologies , Anvil Semiconductors , A Look At Related Research Insights , Texas Instruments Incorporated United States , Semiconductor United States ,