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Toshiba extends optoelectronics portfolio

Toshiba Electronics Europe has strengthened its extensive optoelectronics portfolio with the introduction of a new photorelay, the TLP4590A. ....

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Toshiba unveils new series of LDO voltage regulators


Toshiba unveils new series of LDO voltage regulators
Toshiba Electronics Europe has unveiled a new series of low drop-out (LDO) voltage regulators covering an output voltage range of 0.9V to 5.0V, giving them scope to be employed in a wide variety of potential applications.
The TCR5RG series have a 100dB ripple rejection ratio (when operating at a 1kHz frequency) which has been achieved through the combination of a wide-gap internal circuit topology, an integrated high-speed operational amplifier supporting low noise operation, plus low-pass filtering.
The expansive LDO series comprises a total of 45 different devices, all of which are housed in WCSP4F packages that take up only minimal PCB space. They support a maximum output current of 500mA and have a 5μV (typical) output voltage noise, with a ±1.5% output voltage accuracy at voltages between 1.8V and 2.8V (going to ±1.8% for voltages above 2.8V) and a chip temperature range of -40� ....

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650V superjunction power MOSFETs housed in the new TOLL package

650V superjunction power MOSFETs housed in the new TOLL package
newelectronics.co.uk - get the latest breaking news, showbiz & celebrity photos, sport news & rumours, viral videos and top stories from newelectronics.co.uk Daily Mail and Mail on Sunday newspapers.

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Toshiba introduces compact, but efficient, SiC MOSFET modules


Toshiba introduces compact, but efficient, SiC MOSFET modules
Toshiba Electronics Europe has leveraged its expertise in wide bandgap (WBG) semiconductor processes to introduce a compact but efficient MOSFET module.
The MG800FXF2YMS3 incorporates 3300V-rated dual-channel silicon carbide (SiC) MOSFET devices that are capable of supporting 800A currents.
Key applications for these high power density modules include industrial drives and motor control equipment, the power inverters for renewable energy generation sites, plus the converters/inverters needed for electric rail infrastructure.
Pivotal to the strong performance parameters of the new SiC MOSFET modules is Toshiba s proprietary packaging technology. The intelligent flexible package low voltage (iXPLV) housings employed in these modules rely on an advanced silver sintered internal bonding technology to enable elevated degrees of operational efficiency. ....

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