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Nvidia Accelerates AI Chip Production with New Packaging Tech to Meet Soaring Demand

Nvidia Corp (NASDAQ:NVDA) plans to use Fan-Out Panel Level Packaging (FOPLP) technology for its GB200 AI server chips earlier than scheduled to address the production constraints of Chip on Wafer on Substrate (CoWoS) packaging at Taiwan Semiconductor Manufacturing Co (NYSE:TSM). Industry insiders see FOPLP as a viable alternative to CoWoS due to TSMC’s limited CoWoS capacity and the rising demand for AI chips driven by generative AI applications. A senior executive from China Wafer Level CSP sta ....

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Nvidia Accelerates AI Chip Production with New Packaging Tech to Meet Soaring Demand - NVIDIA (NASDAQ:NVDA)

NVDA plans to use FOPLP for AI server chips to address production constraints at TSMC. Industry sees FOPLP as a viable alternative to CoWoS. ....

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"India Must Not Lose Apple The Way We Lost Samsung to Vietnam"

India Inc must create right space to bolster Apple manufacturing in the country, and the country should not lose the Cupertino-based iPhone maker the way it lost Samsung smartphone manufacturing to Vietnam. ....

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Apple Car - Tech giant in talks with Toyota, Korean battery suppliers for production to commence 2024

Apple Car - Tech giant in talks with Toyota, Korean battery suppliers for production to commence 2024
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مؤتمر أبل اليوم.. آيفون 13 يهدد أغلى "تفاحة" في العالم

مؤتمر أبل اليوم.. آيفون 13 يهدد أغلى "تفاحة" في العالم
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