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Rapidus and IBM Expand Collaboration to Chiplet Packaging Technology for 2nm-Generation Semiconductors

Agreement builds on existing collaboration between the two companies for the joint development of 2nm node technology
TOKYO, June 3, 2024 /PRNewswire/ Rapidus Corporation, a manufacturer of. ....

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Rapidus and IBM Expand Collaboration to Chiplet Packaging Technology for 2nm-Generation Semiconductors

Rapidus and IBM Expand Collaboration to Chiplet Packaging Technology for 2nm-Generation Semiconductors
tmcnet.com - get the latest breaking news, showbiz & celebrity photos, sport news & rumours, viral videos and top stories from tmcnet.com Daily Mail and Mail on Sunday newspapers.

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Rapidus and IBM Expand Collaboration to Chiplet Packaging Technology for 2nm-Generation Semiconductors

Rapidus Corporation, a manufacturer of advanced logic semiconductors, and multinational technology company IBM , today announced a joint development partnership aimed at establishing mass production technologies for chiplet packages. Through this. ....

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Rapidus announces U.S. subsidiary and opens Silicon Valley office; names Henri Richard as GM and president of Rapidus Design Solutions

/PRNewswire/ Rapidus Corporation, a Japanese company dedicated to the research, development, design, manufacture and sales of advanced logic semiconductors,. ....

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Rapidus announces U.S. subsidiary and opens Silicon Valley office; names Henri Richard as GM and president of Rapidus Design Solutions

Rapidus announces U.S. subsidiary and opens Silicon Valley office; names Henri Richard as GM and president of Rapidus Design Solutions
tmcnet.com - get the latest breaking news, showbiz & celebrity photos, sport news & rumours, viral videos and top stories from tmcnet.com Daily Mail and Mail on Sunday newspapers.

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