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TSMC's next-gen COUPE tech: silicon photonics packaging will be ready in 2026

TSMC is developing Compact Universal Photonic Engine (COUPE) technology to support the huge data transmission rates of the AI boom, coming in 2026. ....

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TSMC debuts A16 technology at 2024 North America Technology Symposium

TSMC debuts A16 technology at 2024 North America Technology Symposium
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TSMC says first 1.6nm chips will arrive in 2026

TSMC says first 1.6nm chips will arrive in 2026
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TSMC Celebrates 30th North America Technology Symposium with Innovations Powering AI with Silicon Leadership

TSMC Celebrates 30th North America Technology Symposium with Innovations Powering AI with Silicon Leadership
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TSMC Celebrates 30th North America Technology Symposium with Innovations Powering AI with Silicon Leadership

TSMC Celebrates 30th North America Technology Symposium with Innovations Powering AI with Silicon Leadership
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