/PRNewswire/ SK hynix Inc. (or "the company", www.skhynix.com), the world s leading producer of High-Bandwidth Memory (HBM) chips, announced today that it.
SK hynix Signs Investment Agreement of Advanced Chip Packaging with Indiana tmcnet.com - get the latest breaking news, showbiz & celebrity photos, sport news & rumours, viral videos and top stories from tmcnet.com Daily Mail and Mail on Sunday newspapers.
SK hynix Signs Investment Agreement of Advanced Chip Packaging with Indiana thailand-business-news.com - get the latest breaking news, showbiz & celebrity photos, sport news & rumours, viral videos and top stories from thailand-business-news.com Daily Mail and Mail on Sunday newspapers.
To build advanced packaging facility for next-generation HBM, while collaborating with Purdue University for R&D Selects Indiana for strong support provided by the state and local government, infrastructure for manufacturing, and talent at Purdue. Industry s first investment in advanced packaging for AI products on American soil, strengthens supply-chain resilience SEOUL, South Korea, April 4, 2024 /PRNews.