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Electronics | Free Full-Text | MeMPA: A Memory Mapped M-SIMD Co-Processor to Cope with the Memory Wall Issue

The amazing development of transistor technology has been the main driving force behind modern electronics. Over time, this process has slowed down introducing performance bottlenecks in data-intensive applications. A main cause is the classical von Neumann architecture, which entails constant data exchanges between processing units and data memory, wasting time and power. As a possible alternative, the Beyond von Neumann approach is now rapidly spreading. Although architectures following this paradigm vary a lot in layout and functioning, they all share the same principle: bringing computing elements as near as possible to memory while inserting customized processing elements, able to elaborate more data. Thus, power and time are saved through parallel execution and usage of processing components with local memory elements, optimized for running data-intensive algorithms. Here, a new memory-mapped co-processor (MeMPA) is presented to boost systems performance. MeMPA relies on a progra

GUC Delivers its First TSMC N3 Chip and First AI-Optimized N5 Design Using Cadence Digital Solutions

Highlights: • Using Innovus Implementation, GUC delivered a 3.16GHz HPC core design with 3.5M instances on the TSMC N3 process technology • GUC realized a 9% area shrink and an 8% reduction in power consumption on a CPU design on the TSMC N5 process using the AI-enabled Cadence Cerebrus SAN JOSE, Calif., January 19, 2023  Cadence…

GUC Delivers its First TSMC N3 Chip, AI-Optimized N5 Design Using Cadence Digital Solutions

GUC Delivers its First TSMC N3 Chip, AI-Optimized N5 Design Using Cadence Digital Solutions
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