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Intel Introduces Two Monolithic Agilex FPGA and SoC Families, Part 2: Sundance Mesa is now the Agilex 5 E-Series

Last September, I published an article on EEJournal.com that described two new Intel Agilex FPGA and SoC device families, the Agilex 5 D-series and an as-yet-unnamed series formerly known as “Sundance Mesa,” introduced at last year’s Intel Innovation. (See “Intel Introduces Two Monolithic Agilex FPGA and SoC Families, Part 1.”) As discussed in that previous…

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Electronic Circuit Board Level Underfill Material Market is projected to grow at a CAGR of 5 7% throughout the 2017-2027 timeline

Electronic Circuit Board Level Underfill Material Market is projected to grow at a CAGR of 5 7% throughout the 2017-2027 timeline
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Intel Quietly Launches Tiger Lake B-Series Desktop CPUs

Intel just released (in a relatively low-key way) four new Tiger Lake CPUs, all with the "B" suffix in them, which means that they're basically platform-locked. But should you care?

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Under Fill Dispenser Market size See Incredible Growth during 2026

Under Fill Dispenser Market size See Incredible Growth during 2026 Under Fill Dispenser Market size See Incredible Growth during 2026 BriefingWire.com, 5/05/2021 - arket Scenario Under Fill Dispenser Market was valued US$50.76 Bn by 2017 and is estimated to reach US$110.26 Bn by 2026 at a CAGR of about 9.0% during a forecast period. An objective of under fill Dispenser market is to grow Technological advancements in under fill such as control of flow rates; improving filler as well as modulus properties have brought enhanced performance capabilities to the semiconductor industry. Currently industry in market will take its pace towards more flexible, efficient devices, more under fill technology requirement. Further these systems addresses the challenges that MEMS (Micromechanical Systems) and SiP (System-in-Package) packages face as these packages are being used in Smartphones and many electronic assemblies.

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Electronic Circuit Board Underfill Material Market 2020 - Overview and Analysis, COVID-19 Impact Analysis, Market Status and Forecast by Players, Regions to 2027

Electronic Circuit Board Underfill Material Market 2020 - Overview and Analysis, COVID-19 Impact Analysis, Market Status and Forecast by Players, Regions to 2027
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