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DIGITIMES Asia: Samsung achieves technical breakthrough, stacking 3D DRAM to 16 layers

/PRNewswire/ According to the news report from the technology-focused media DIGITIMES Asia, Samsung Electronics has successfully stacked the next-gen 3D.

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Samsung achieves technical breakthrough, stacking 3D DRAM to 16 layers

Samsung Electronics has successfully stacked the next-gen 3D DRAM to 16 layers, twice as many as its competitor Micron.

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TSMC introduces cheaper 4nm chips, vows to bring 1.6nm chips in 2026

TSMC announced its 1.6nm chip fabrication process, and mass production of such chips will start in 2026. It also revealed cheaper 4nm chip process. - SamMobile

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Samsung's new tech to make 2nm chips more powerful and efficient

Samsung is planning on implementing the BSPDN technology in the 2nm chips for reduced die size and improved efficiency and performance. - SamMobile

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TSMC Throws Shade At Intel's 18A Node As Being Inferior To Its 2nm Chip Tech

In an earnings Q&A, TSMC CEO Dr. C. C. Wei made some pretty sensational claims about Intel s manufacturing process technology.

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