comparemela.com

Latest Breaking News On - Backside power delivery network - Page 1 : comparemela.com

DIGITIMES Asia: Samsung achieves technical breakthrough, stacking 3D DRAM to 16 layers

/PRNewswire/ According to the news report from the technology-focused media DIGITIMES Asia, Samsung Electronics has successfully stacked the next-gen 3D.

T ai peiJack wuJessica tsaiBackside power delivery networkSamsung electronics

Samsung achieves technical breakthrough, stacking 3D DRAM to 16 layers

Samsung Electronics has successfully stacked the next-gen 3D DRAM to 16 layers, twice as many as its competitor Micron.

Backside power delivery networkSamsung electronics

TSMC introduces cheaper 4nm chips, vows to bring 1 6nm chips in 2026

TSMC announced its 1.6nm chip fabrication process, and mass production of such chips will start in 2026. It also revealed cheaper 4nm chip process. - SamMobile

South koreaUnited statesSouth koreanBackside power delivery networkChip fabrication process technologyAmerican technology symposiumSamsung foundryNorth american technology symposiumChip fabrication processChip fabrication process technology roadmapGate all around field effect transistor

Samsung s new tech to make 2nm chips more powerful and efficient

Samsung is planning on implementing the BSPDN technology in the 2nm chips for reduced die size and improved efficiency and performance. - SamMobile

Backside power delivery networkIntel foundry serviceChosun bizSamsung foundryFoundry service

TSMC Throws Shade At Intel s 18A Node As Being Inferior To Its 2nm Chip Tech

In an earnings Q&A, TSMC CEO Dr. C. C. Wei made some pretty sensational claims about Intel s manufacturing process technology.

Gokul hariharanPat gelsingerJp morgan chaseIntel backside power delivery networkMeteor lakeMotley foolBackside power delivery networkAsdaq intc

vimarsana © 2020. All Rights Reserved.