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NVIDIA and AMD have reserved all of TSMC s CoWOS and SoIC advanced packaging for 2024 and 2025

NVIDIA and AMD have purchased all of TSMC's advanced packaging production capacity including CoWoS and SoIC for 2024 and 2025: they're 'fully booked'.

Smc cowosAdvanced packagingTsmc advanced packagingAi gpuNstinct mi300x

TSMC to expand advanced packaging capacity at 3 plants: CoWoS, SoIC, SoW for AI GPU demand

The unstoppable demand of AI and one of the keys apart from the GPU and HBM is advanced packaging production, something TSMC is boosting right now.

Jiayi shiChiayi science parkAdvanced packagingAi gpuK hynix

Samsung establishes dream team of engineers to win AI chip orders from NVIDIA

Samsung has established a team for billions of dollars worth of HBM memory chip supply deals with NVIDIA, to beat HBM leader SK hynix.

South koreaSouth koreanJensen huangK hynixAi gpuI gpu orders200 ai gpu

HBM prices to increase 5-10% in 2025, while DDR5 prices to increase 15-20% for PC gamers

SK hynix and Micron are sold out of 2024 + 2025 HBM supply, with TrendForce estimating a 5-10% increase in HBM memory pricing in 2025.

Avril wuSenior research viceK hynixBm pricingAi gpuNsintct mi300x

SK hynix expects HBM memory chip revenues of over $10 billion in 2024

SK hynix expects to hit $10+ billion in revenue from HBM sales by the end of 2024, as most of its HBM 2024 and even HBM 2025 supply is already sold out.

South koreaCh ungch ong buktoSouth koreanKwak noh jungSk hynixK hynix 10b 2024K hynix hbmK hynix hbm revenueAi gpu

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