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BE Semiconductor Industries N V Announces Q4-23 and Full Year 2023 Results

BE Semiconductor Industries N V Announces Q4-23 and Full Year 2023 Results
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Semiconductor packaging: A new front in US-China contest for tech supremacy | Jane Lanhee Lee, Ian King, Mackenzie Hawkins & Jillian Deutsch

President Joe Biden has adopted a two-pronged approach to constrain China’s high-tech progress, curbing Beijing’s access to leading edge chips while bolstering semiconductor production in the US. He’s about to ratchet up the pressure further, shifting focus to an emerging arena of the contest for technological supremacy: the process of…

A New Front Is Opening Up in the US-China Conflict Over Chips

A New Front Is Opening Up in the US-China Conflict Over Chips
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A new front is opening up in the US-China conflict over chips

Semiconductor Manufacturing: A new front is opening up in the US-China conflict over chips, ET Telecom

Semiconductor Manufacturing: Assembly, testing and packaging – usually considered together as “back-end” manufacturing - was always the least glamorous end of the semiconductor industry, with less innovation and lower added value than the “front end” business of making chips with features measured in the billionths of a meter.

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