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Intel s next-gen Xeon Clearwater Forest CPUs rumored with 3D stacking with hybrid bonding

Intel's next-gen Clearwater Forest Xeon CPUs should feature Foveros Direct technology to 3D stack up to 288 Darkmont E-Cores on a single Xeon CPU.

Alder Lake should be worried: AMD teases 3D V-cache on Ryzen 9 5900X, 192 MB 2 TB/s L3 cache results in 15% fps gains; Possible Zen 3+ Warhol incoming

Ticker  During AMD s Computex 2021 keynote earlier today, CEO Dr. Lisa Su made a stunning disclosure that may have major ramifications in the days to come for the computing industry. Dr. Su announced that AMD will be producing 3D-stacked chiplets later this year. These chiplets come with stacked caches called 3D V-cache (vertical cache) that is expected to significantly boost gaming performance.  AMD s 3D V-cache allows stacking an additional 64 MB of SRAM cache vertically on top of each core complex die (CCD). For the current Ryzen 5000 series chips such as the Ryzen 9 5900X and the Ryzen 9 5950X, this means three such stacked 3D V-caches totaling a whopping 192 MB of L3 cache per processor.

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