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SK hynix confirms $3.87 billion advanced packaging plant, R&D facility for AI in Indiana, USA : comparemela.com
SK hynix confirms $3.87 billion advanced packaging plant, R&D facility for AI in Indiana, USA
SK hynix confirms advanced packaging facility for next-gen HBM, collaborating with Purdue University for R&D, with $3.87 billion facility in Indiana, USA.
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