KeyASIC Inked Technologies and IP Deal of RM21Mil
Petaling Jaya, 25 January 2021 -- Key ASIC announced today that it has inked a contract valued at RM21,000,000 for first part of the project with Canvas Technology to provide product, technology and design IP development strategy, planning and implementation for a wafer fab. The project is planned to have multiple parts and contracts of subsequent parts are expected to follow in the near future.
To date, the market capitalization of semiconductors has exceeded USD4 trillion, powered by the digitalization of economy globally. In the past two years, there is a surge on the construction new fabs or repurpose of existing wafer fabs. Reported by SEMI in August 2019, 33 new wafer fabs were under construction and over 50 of the existing fabs are repurposed for the current technologies to meet the market trend. Expectedly, leading this wave of development is China with spending of USD24B followed by Taiwan with spending of $13B and Europe and Mideast with spending of USD11B. This created a strong demand for licensing of technologies and Design IPs so that these expensive fabs can churn out chips at the soonest, reducing the time to revenue.