Cadence Receives TSMC OIP Ecosystem Forum Customers’ Choice Award for N3 Collaboration Cadence Design Systems, Inc. has announced that it has received a TSMC Open Innovation Platform® (OIP) Ecosystem Forum Customers’ Choice award for a paper, “Optimized Digital Design, Implementation and Signoff on TSMC’s N3,” which was presented during the TSMC 2020 North America OIP Ecosystem Forum. Cadence’s Yufeng Luo, vice president, R&D in the Digital & Signoff Group, presented the paper, highlighting how engineers creating hyperscale and mobile designs can successfully benefit from the performance and efficiency of the TSMC N3 process technology and the Cadence® digital full flow.