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The Emergence of 2 5D Custom SoCs and Chiplets in AI and HPC Applications

The Emergence of 2.5D Custom SoCs and Chiplets in AI and HPC Applications Webinar Overview 2021 promises to be the breakthrough year when 2.5D based custom SoCs and chiplets will play a very prominent role in turbo-charging cloud/AI, HPC, networking and storage applications. Join us for this webinar to learn more about how OpenFive is collaborating with our customers and partners to drive domain-specific innovations in Die-to-Die (D2D) IP, custom silicon and advanced package design methodologies. Key Learnings: Who Should Attend?: Speaker VP, Product & Corporate Marketing Sudhir Mallya is Vice President of Corporate and Product Marketing. He is responsible for custom silicon product marketing, technology roadmaps and business model innovation, corporate marketing initiatives, and strategic customer and partner alliances. He was previously at Toshiba where he led their North American silicon BU with a focus on data center and automotive applications. He is based in Silicon Val

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