Product News: Onto Innovation Announces New Inspection Platform for Leading-Edge Process Control and Device Reliability Onto Innovation Inc. (NYSE: ONTO) today announced the availability of its new Dragonfly G3 inspection platform designed to meet the most advanced 2D and 3D sensitivity requirements for advanced packaging and specialty device manufacturers. The first Dragonfly G3 system was delivered to a leading OSAT partner in the fourth quarter of 2020. Orders received from a leading CMOS image sensor (CIS) manufacturer will be shipped in the first quarter of 2021 along with additional evaluation units to logic and memory customers. The Dragonfly G3 platform includes a newly designed optical system with sub-micron resolution, greatly improving 2D defect detection capability in either bright field, dark field or Clearfind
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Onto Innovation Expands its 23rd Annual Needham Virtual Growth Conference Schedule
January 8, 2021 GMT
WILMINGTON, Mass. (BUSINESS WIRE) Jan 8, 2021
Onto Innovation Inc. (NYSE: ONTO) today announced that due to high demand for one-on-one meetings, the Company has expanded its participation schedule. Onto Innovation’s presentation will be webcast live at 4:15 p.m. EST on January 13, 2021. Michael Plisinski, chief executive officer, and Steven Roth, chief financial officer, will now be available for one-on-one meetings during the conference on January 13, 14, 15, 2021. To schedule a meeting please contact your Needham salesperson.
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Onto Innovation Inc. (NYSE: ONTO) today announced the first customer acceptance and purchase of its new product, the Aspect
® System, at one of the top three memory manufacturers of leading-edge 3D-NAND devices. After successful factory demonstrations, additional Aspect systems are shipping this quarter and in the first quarter of 2021 for evaluations at leading 3D-NAND manufacturers. All of these customers are expected to utilize the high-speed capabilities of the Aspect System to accurately measure extremely deep, high aspect ratio channel holes used to connect over 128 layers and support development and production of customers’ next generation 174 – 192 layer stacked-pair devices. The Company expects additional applications to emerge as this revolutionary infrared critical dimension (IRCD) technology is moved into production environments.