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Onto Innovation Inc. (NYSE: ONTO) today announced the first customer acceptance and purchase of its new product, the Aspect
® System, at one of the top three memory manufacturers of leading-edge 3D-NAND devices. After successful factory demonstrations, additional Aspect systems are shipping this quarter and in the first quarter of 2021 for evaluations at leading 3D-NAND manufacturers. All of these customers are expected to utilize the high-speed capabilities of the Aspect System to accurately measure extremely deep, high aspect ratio channel holes used to connect over 128 layers and support development and production of customers’ next generation 174 – 192 layer stacked-pair devices. The Company expects additional applications to emerge as this revolutionary infrared critical dimension (IRCD) technology is moved into production environments.