Latest Breaking News On - ப்ரோஸெஸிஂக் உபகரணங்கள் - Page 1 : comparemela.com

NEW YORK, July 25, 2021 /PRNewswire/ The global wafer dicing saws market is expected to grow by USD 91.16 million during 2021-2025, according to Technavio s latest market report. Based on our research, the Semiconductor Equipment sector witnessed a Mixed impact due to the widespread growth of the COVID-19 pandemic. The report also throws light on the pre- and post-impact of COVID-19 on businesses. - Advertisement - The wafer dicing saws market share growth by the pureplay foundries segment has been significant and is expected to provide significant growth opportunities to market vendors. 86% of the market s growth will originate from APAC during the forecast period. Taiwan, South Korea (Republic of Korea), Japan, and China are the key markets for wafer dicing saws market in APAC.

United statesSouth koreaUnited kingdomJesse maidaSemiconductor equipmentDynatex internationalInformation technologyTechnavio researchDicing saws marketMajor growthKey vendorDicing technologiesDicing bladesPeripheral equipmentProcessing equipmentBreak consumables