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DIH Signs Strategic Partnership with Reha Technology

DIH Signs Strategic Partnership with Reha Technology
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DIH partners with Reha Technology

DIH partners with Reha Technology A strategic partnership to provide market leading solutions in the lower extremities rehabilitation. DIH, the leading global robotics and virtual reality (VR) technology provider, announced today that it has entered into a strategic partnership agreement with Reha Technology. Under this agreement, DIH will take over the distribution of Reha Technology s robotics products, an effective immediately DIH will promote and distribute Reha Technology s end-effector-based gait therapy devices in key markets such as Switzerland, Germany and the US. We are very excited with the addition of the portfolio from Reha Technology. This strategic partnership is another testimony of DIH s passion to continue to bring the best in our industry together, and to transform the rehabilitation care model , says Jason Chen, CEO and Chairman of DIH.

NexWafe raises $12 million to scale up highly efficient, greener monocrystalline silicon wafers

With this additional cash infusion, NexWafe will move forward with further industrialization of its EpiNex green high-efficiency solar wafer technology and begin its pilot manufacturing activities. As the company moves into its next stage, it is also intensifying discussions with potential partners to commercialize the technology. The company’s CEO, Davor Sutija, has a longstanding track record in creating such partnerships and will be leading this effort. He was appointed to his position in September. What’s cool? By minimizing waste through its direct-gas-to-wafer manufacturing, NexWafe’s Epinex wafers are fully compatible with conventional solar cell and module manufacturing with a 70 percent reduction in carbon footprint of conventional wafers and at greatly reduced production cost. Using a proprietary process, a crystalline silicon layer is deposited on a seed wafer and then detached, producing finished wafers with an optimal thinness and superior material properties. Th

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