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Nanotechnology Now - Press Release: CEA-Leti Papers at IEDM 2020 Highlight Progress in Overcoming Challenges to Making GaN Energy-Saving, Power-Electronics Devices: Gallium Nitride Seen as Highly Efficient Replacement for Silicon In Wide Range of Consumer and Industrial Uses

Our NanoNews Digest Sponsors Home > Press > CEA-Leti Papers at IEDM 2020 Highlight Progress in Overcoming Challenges to Making GaN Energy-Saving, Power-Electronics Devices: Gallium Nitride Seen as Highly Efficient Replacement for Silicon In Wide Range of Consumer and Industrial Uses Abstract: Two complementary research papers from CEA-Leti confirmed that the institute’s approach to gallium-nitride (GaN) technologies is on track overcome challenges in the architecture and performance of advanced GaN devices embedding a MOS gate, and targeting the fast-growing global market for power-conversion systems. CEA-Leti Papers at IEDM 2020 Highlight Progress in Overcoming Challenges to Making GaN Energy-Saving, Power-Electronics Devices: Gallium Nitride Seen as Highly Efficient Replacement for Silicon In Wide Range of Consumer and Industrial Uses

Tower Semiconductor and OPIX Announce the Successful Development of a World Class iToF Technology Platform for 3D Imaging and Face Recognition Applications

Tower Semiconductor and OPIX Announce the Successful Development of a World Class iToF Technology Platform for 3D Imaging and Face Recognition Applications GlobeNewswire         Featuring state of the art performance including multiple depth sensing and distance measurement applications for a broad range of fast-growing markets such as mobile, AR/VR, retail, robotics, and automation Based on Tower’s leading-edge pixel-level stacked wafer BSI technology with enhanced NIR sensitivity MIGDAL HAEMEK, Israel, and SHENZEN, China, December 15, 2020 – Tower Semiconductor (NASDAQ/TASE: TSEM), the leader in high-value analog semiconductor foundry solutions, and OPIX, an innovative supplier of 3D Time-of-Flight (ToF) image sensor solutions, today announced the successful development of a world class iToF technology platform for 3D imaging and face recognition,  featuring multiple depth sensing and distance measurement applications for a broad range of m

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