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OpenFive Launches Die-to-Die Interface Solution for Chiplet Ecosystem

Features IOs running at up to 16Gbps (effective throughput of ~1.75Tbps/mm) Features extremely low latency and 0.5pJ/bit offering best power performance benchmarks SAN MATEO, Calif.–(BUSINESS WIRE)–OpenFive, the leading provider of customizable, silicon-focused solutions with differentiated IP, today announced the launch of a Die-to-Die (D2D) PHY that complements the company’s existing D2D Controller to offer complete D2D interface solutions for various packages including substrates and interposers. The new D2D PHY helps disaggregate large SoC die into smaller die, resulting in better yield, cost and power savings. It features up to 16Gbps NRZ signals with clock forwarding architecture. Each channel, comprising of 40 IOs, can provide effective throughput of up to ~1.75Tbps/mm. Users can stack up multiple channels to further increase overall throughput. The PHY also features built-in PLL, programmable output drivers, and link training state machines.

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