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MIL-OSI: Micron Accelerates Breakthrough Platform Innovation With Advancements Across Industry s First 176-Layer NAND and 1-Alpha DRAM

MIL-OSI: Micron Accelerates Breakthrough Platform Innovation With Advancements Across Industry s First 176-Layer NAND and 1-Alpha DRAM
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CDRLabs com - MIcron Unveils New Memory And Storage Innovations At Computex 2021

Micron Technology, Inc., today unveiled memory and storage innovations across its portfolio based on its industry-leading 176-layer NAND and 1α (1-alpha) DRAM technology, as well as the industry’s first Universal Flash Storage (UFS) 3.1 solution for automotive applications. The new portfolio additions deliver on the company’s vision of accelerating data-driven insights through innovations in memory and storage that enable new capabilities from the data center to the intelligent edge. Micron President and CEO Sanjay Mehrotra made the announcements during a Computex keynote, in which he shared a sweeping vision for computing innovation and the central role memory and storage play in enabling enterprises to seize the full potential of the data economy.

Micron Accelerates Breakthrough Platform Innovation With Advancements Across Industry s First 176-Layer NAND and 1-Alpha DRAM

Micron Accelerates Breakthrough Platform Innovation With Advancements Across Industry s First 176-Layer NAND and 1-Alpha DRAM
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