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Samsung maakt eerste geheugenmodule met CXL-interface

Samsung maakt eerste geheugenmodule met CXL-interface
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Global IO Link System Market to 2025 with Profiles of Leading Players | Balluff, Datalogic, Festo Group, ifm electronics, Omron Corp , Siemens, and SICK AG

Share this article Share this article ResearchAndMarkets.com s offering. In this report, the market is segmented by component, data type, application, industry and geography. The report provides an overview of the global IO-Link system market and analyzes market trends and challenges that affect the vendor landscape. Using 2019 as the base year, the report provides market projections for the forecast period 2020 through 2025. This report also takes into consideration the economic slowdown caused by lockdowns across the world due to the COVID-19 pandemic. The Report Includes: An overview of global market for IO-Link systems Estimation of the market size and analyses of market trends, with data from 2019, estimates for 2020, and projections of compound annual growth rates (CAGRs) through 2025

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