ARTICLE DATEARTICLE AUTHOR AUTHOR EMAIL February 08, 2021
Last week, Amazon unveiled its architectural plans for its highly anticipated second headquarters in Arlington, just a few hours north of the University of Virginia.
The centerpiece of the planned complex, which also includes three traditional office buildings, is “The Helix,” a 350-foot tall steel and glass tower lined with greenery – including fully grown trees – that spirals upward in exposed pathways along the building’s exterior. Architectural firm NBBJ, which designed the building for Amazon, likened it to the double helix shape of DNA strands. Others on social media saw an ice cream cone, the Tower of Babel, and a few less kind comparisons.
The round was led by Metellus AG and Dara Capital Ltd., alongside existing shareholders and family offices.
The company intends to use the funds to accelerate the commercialization of its patented RF front end technologies, expand the engineering team, and to scale the product development of 5G/UHB (Ultra High Band) and Wi-Fi 6/6e front-end IC components.
Led by Dr. Ali Fard, CEO/CTO, and Antonio J. Viana, Executive Chairman, QuantalRF is an RF semiconductor company developing wireless communication solutions focused on front-end IC parts such as Power Amplifiers (PA), Low Noise Amplifiers (LNA), on-chip Filters focused on a wide range of communication systems including Wi-Fi 6/6e and 5G UHB (Ultra-High Band).
QuantalRF secures CHF17M / $19M Series B funding to develop and commercialize disruptive RF front-end solutions
ZÜRICH and SAN DIEGO, Dec. 15, 2020 /PRNewswire/ QuantalRF, an emerging RF semiconductor company developing transformative wireless communication solutions, has announced the closing of an oversubscribed Series B funding round, resulting in CHF17 million / $19 million. The growth equity round was led by Zürich based Metellus AG and Dara Capital Ltd., alongside existing shareholders and family offices.
The new funding will be used primarily to accelerate the commercialization of QuantalRF s patented RF front end technologies, expand the engineering team, and to rapidly scale the product development of 5G/UHB (Ultra High Band) and Wi-Fi 6/6e front-end IC components.
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