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In June 2021, Patently Apple posted a report titled "TSMC s 3DFabric Technology is the next big wave in Chip Design that Apple will take advantage of in the not-too-distant Future." The news was rolled into an Apple patent titled "High Density Interconnection using Fanout Interposer Chiplet." Today we re learning that Apple is testing .

Dfabric technologyD fabric technologyPatently appleChip designDensity interconnectionFanout interposer chipletSilicon stackingAdvanced packaging technologiesTaiwanese financial siteDfabric technologyZhuke tongluoMacbook proChain newsApple is reportedly testing 3d fabric technology as tsmc plans to mass produce chip stacking packaging by 2027 for and others