Taipei, April 1 (CNA) Taiwan Semiconductor Manufacturing Co. (TSMC), the world's largest contract chipmaker, on Saturday opened an overseas operations office to supervise fabs under construction in the U.S. state of Arizona and Japan's Kumamoto Prefecture.
Taipei, April 20 (CNA) The construction of a wafer fab to be run by a Taiwan Semiconductor Manufacturing Co. (TSMC) joint venture will start on Thursday, according to Japan Advanced Semiconductor Manufacturing, Inc. (JASM), the joint venture.
The construction of a wafer fab in Japan to be run by a joint venture led by Taiwan Semiconductor Manufacturing Co (TSMC, 台積電) is to begin today.
Japan Advanced Semiconductor Manufacturing Inc (JASM), the joint venture, said that it signed an agreement with authorities in Kikuyo-machi in Japan’s Kumamoto Prefecture on Tuesday, with company president Yuichi Horita announcing the schedule for the new plant’s construction.
The plant is expected to begin shipping products in December 2024, Horita said.
In November last year, TSMC, the world’s largest contract chipmaker, said it would spend up to US$2.12 billion in equity investment on the wafer