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UMC Introduces Industry s First 3D IC Solution for RFSOI, Accelerating Innovations in the 5G Era
News Highlights: UMC s 3D IC solution for RFSOI reduces circuit footprint by more than 45%, enabling integration of more RF components in 5G-enabled devices. UMC s innovative 3D IC technology.
United states
South korea
Raj verma
Exchange commission
Wavetek microelectronics corporation
United microelectronics corporation
Technology development
Business wire
Associate vice president
UMC Introduces Industry s First 3D IC Solution for RFSOI, Accelerating Innovations in the 5G Era | National Business
HSINCHU, Taiwan (BUSINESS WIRE) May 2, 2024
United states
South korea
Raj verma
Fu tsau
Wavetek microelectronics corporation
Corporate communications
Exchange commission
Technology development
United microelectronics corporation
Microelectronics corporation
Business wire
Associate vice president
United microelectronics
National business
UMC Introduces Industry s First 3D IC Solution for RFSOI, Accelerating Innovations in the 5G Era | Business
HSINCHU, Taiwan (BUSINESS WIRE) May 2, 2024
South korea
United states
Fu tsau
Raj verma
Technology development
Corporate communications
Exchange commission
United microelectronics corporation
Wavetek microelectronics corporation
Microelectronics corporation
Business wire
Associate vice president
United microelectronics
UMC Introduces Industry s First 3D IC Solution for RFSOI, Accelerating Innovations in the 5G Era | Region
HSINCHU, Taiwan (BUSINESS WIRE) May 2, 2024
South korea
United states
Fu tsau
Raj verma
Technology development
Corporate communications
Exchange commission
United microelectronics corporation
Wavetek microelectronics corporation
Microelectronics corporation
Business wire
Associate vice president
United microelectronics
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