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Circuits Assembly Online Magazine - Indium Corporation s Sze Pei Lim to Present at ICEP Japan

Indium Corporation’s Senior Global Product Manager for Semiconductor and Advanced Materials Sze Pei Lim is set to deliver a presentation at ICEP 2023 in Kumamoto, Japan, on April 19. The presentation will cover the findings from a technical paper, co-authored by R&D Manager for the Alloy Group HongWen Zhang, titled An In-Containing Lower-Temperature Lead-Free Solder Paste for Wafer-Level Package Application that Outperforms SAC305.

National university of singaporeSingapore generalSouth koreaUnited kingdomMike buetowIndium corporationInstitute of electricalPackaging society malaysia chapterNemi packaging technology integration groupInternational electronics manufacturing initiativeAlloy group hongwen zhangIndium corporation senior global productElectronics engineersInternational electronics manufacturing technologySenior global product managerAdvanced materials sze pei lim

Indium Corporation s Sze Pei Lim to Present at ICEP Japan · EMSNow

Indium Corporation’s Senior Global Product Manager for Semiconductor and Advanced Materials Sze Pei Lim is set to deliver a presentation at ICEP 2023 in

United kingdomSouth koreaNational university of singaporeSingapore generalHongwen zhangNemi packaging technology integration groupPackaging society malaysia chapterElectronics engineersMalloy groupInternational electronics manufacturing initiativeInstitute of electricalManufacturing technologyIndium corporationIndium corporation senior global productSenior global product managerAdvanced materials

Indium Expert to Present on Unique High-Reliability Alloy Technologies at IEMT

Indium Expert to Present on Unique High-Reliability Alloy Technologies at IEMT
iconnect007.com - get the latest breaking news, showbiz & celebrity photos, sport news & rumours, viral videos and top stories from iconnect007.com Daily Mail and Mail on Sunday newspapers.

Hongwen zhangChinese academy of scienceThayer school of engineering at dartmouth collegeCentral south university of chinaInternational electronics manufacturing technologyMichigan technological universityIndium corporationIndium corporation durafuseInstitute of metal researchDrop in high temperature lead free solder pasteOutperforms high pb pastesPower discrete applicationsNovel lead free lower temperature solder pasteWafer level package applicationCentral south universityMetal research

Indium Corporation Experts to Present at IMAPS 2022

Three Indium Corporation experts will share their industry knowledge and expertise during four presentations at the 55th International Symposium on Microelectronics (IMAPS) from Oct. 3-6 in Boston, Mass., U.S.

United statesHongwen zhangKevan griffithIndium corporation guangyu fanChinese academy of scienceThayer school of engineering at dartmouth collegeInternational symposium on microelectronicsCentral south university of chinaFine solder paste printing in sip assemblyMichigan technological universityIndium corporationInstitute of metal researchThree indium corporationInternational symposiumLead free lower temperature solder pasteWafer level package application

Indium Corporation Experts to Present at IMAPS 2022

Indium Corporation Experts to Present at IMAPS 2022
iconnect007.com - get the latest breaking news, showbiz & celebrity photos, sport news & rumours, viral videos and top stories from iconnect007.com Daily Mail and Mail on Sunday newspapers.

United statesRonaldc laskyDefectsby christopher nashHongwen zhangKevan griffithIndium corporation guangyu fanChinese academy of scienceInternational symposium on microelectronicsThayer school of engineering at dartmouth collegeCentral south university of chinaFine solder paste printing in sip assemblyMichigan technological universityIndium corporationInstitute of metal researchInternational symposiumLead free lower temperature solder paste