Latest Breaking News On - Tsmc bailed qualcomm out ofa jam earlier this year when the snapdragon 888 produced by samsung caused overheating issues - Page 1 : comparemela.com
TSMC bailed Qualcomm out of a jam earlier this year when the Snapdragon 888 produced by Samsung caused overheating issues
It s being reported today by United Daily News in Taiwan that although Qualcomm commissioned Samsung s 5G chips for it s Snapdragon processors, Qualcomm had to call on TSMC to urgently assist them when Samsung s chips were faulty with heating issues.
At the beginning of December last year, Qualcomm announced the launch of the high-end flagship processor Snapdragon 888, emphasizing the performance of the top specifications, using Samsung s 5nm process production.
However, the first Xiaomi Mi 11 smartphones to introduce the Snapdragon 888 processor experienced many overheated problems and power consumption issues. Qualcomm then launched the 7nm Snapdragon 870 , to make up for the correction of the shortcomings of Snapdragon 888. It was then adopted by OPPO, OnePlus, Xiaomi, iQOO, Motorola and other brand mobile phones in the first quarter of th