The O-RAN ALLIANCE has successfully conducted its O-RAN Global PlugFest 2021 to demonstrate the functionality and multi-vendor interoperability of O-RAN based network equipment.
O-RAN Global PlugFest 2021 more than doubles with 144 corporate participants in the 7 global venues Scope includes multi-vendor interoperability, Radio Intelligent Controllers, O-Cloud, infrastructure
March 1, 2021
Intel has released a new model in its end-user QLC SSD line with the Intel 670p. A step up from the Intel 665p, the new SSD is based on the company’s 144-layer 3D NAND and leverages an NVMe interface. Much like its predecessors, the Intel SSD 670p is a single-sided M.2 form factor and comes in capacities up to 2TB. The drive is designed for general use, like web tasks and light office applications.
Intel has released a new model in its end-user QLC SSD line with the Intel 670p. A step up from the Intel 665p, the new SSD is based on the company’s 144-layer 3D NAND and leverages an NVMe interface. Much like its predecessors, the Intel SSD 670p is a single-sided M.2 form factor and comes in capacities up to 2TB. The drive is designed for general use, like web tasks and light office applications.