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Toppan and IBM to advance development of EUV photomasks

Toppan Photomask has entered into a joint research and development agreement with IBM related to the 2 nanometer (nm) logic semiconductor node, using extreme ultraviolet (EUV) lithography. The agreement also includes High-NA EUV photomask development capability on next-generation semiconductors.

Toppan partners with IBM on 2nm logic semiconductor node

Toppan Photomask has confirmed a five year agreement with IBM to develop a 2 nanometer logic semiconductor node using extreme ultraviolet (EUV) lithography.

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