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Tokyo Tech s BBCube Tech Boosts 3D Semiconductor Manufacturing

Tokyo Tech s BBCube Tech Boosts 3D Semiconductor Manufacturing
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T ai peiNational cheng kung universityTainan municipalityTakayuki ohbaInstitute of innovative researchChi mei optoelectronicsTokyo institute of technologyCo ltdInnolux corporationFunctional integration unitOhba laboratoryInnovative researchTokyo instituteProfessor takayuki ohbaBumpless build cubeUsing wafer on

Three-dimensional integration of processing units and memory for much faster computing

Three-dimensional integration of processing units and memory for much faster computing
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Takayuki ohbaTokyo institute of technology techTokyo techTokyo instituteBuild cube

BBCube 3D: a breakthrough in semiconductor in

A technology for the three-dimensional integration of processing units and memory, as reported by researchers from Tokyo Tech, has achieved the highest attainable performance in the whole world, paving the way to faster and more efficient computing. Named "BBCube 3D," this innovative stacked architecture achieves higher data bandwidths than state-of-the-art memory technologies, while also minimizing the energy needed for bit access.

Takayuki ohbaTokyo institute of technology techLowest bit access energyMethod of researchTokyo techTokyo instituteBuild cubeIntegration using wowLowest bit access

BBCube 3D: Breakthrough in Semiconductor Integration & Data Transmission

BBCube 3D: Breakthrough in Semiconductor Integration & Data Transmission
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Takayuki ohbaTokyo institute of technology techTokyo instituteTokyo techBuild cube

BBCube 3D: Implementing CPU/GPU and memory in a hybrid 3D approach

BBCube 3D: Implementing CPU/GPU and memory in a hybrid 3D approach
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Takayuki ohbaLowest bit access energyTokyo institute of technologyTokyo institute of technology techTokyo instituteTokyo techBuild cubeBumpless build cubeIntegration using wowLowest bit access