Qualcomm Revealed their Next-Gen 3D Sonic Sensor for In-Display Biometrics at CES 2021 Today
In November 2019 Patently Apple posted a report titled Samsung and other Android Smartphone OEMs may be Hesitant to use Qualcomm s Ultrasonic Fingerprint Sensors in 2020. The first generation was quickly adopted by Samsung and it backfired on them with the financial and securities industry when a serious security flaw with discovered. Fourteen months later and Qualcomm has introduced the second generation of their biometrics technology.
Today at CES 2021, Qualcomm Technologies received an Innovation Award for their 3D Sonic Max, the second-generation 3D Sonic Sensor which is now 77 percent larger than its predecessor. Mobile devices with Qualcomm 3D Sonic Max are expected to be available later this year.
Qualcomm 3D Sonic Sensor Gen 2 is 50% faster and 77% larger, could debut in Galaxy S21
Qualcomm has introduced Qualcomm 3D Sonic Sensor Gen 2 after it introduced Gen 1 for flexible OLED displays back in 2018. The second-generation sensor comes in two new sizes that are 50% faster and 77% larger compared to Gen 1.
The Qualcomm 3D Sonic Sensor Gen 2 sensor is 8×8 (64mm2), which is 77% larger than Gen 1, compared to Gen 1 which was 4x9mm (surface area 36mm2). The larger sensor with a larger region allows Qualcomm 3D Sonic Sensor to capture 1.7x more biometric data.
This larger sensor combined with faster processing will be 50% faster than Gen 1, so you can unlock your device quicker than ever, said the company.
A couple of years ago, just before 2018 ended, Qualcomm introduced the Qualcomm 3D Sonic Sensor. It’s an in-display fingerprint scanning technology that has been used on numerous smartphones out in the market. It’s only one of the many technologies by the company and it’s finally getting a follow-up. The second generation is available and […]