Posted January 21st, 2021 for Indium Corporation January 21, 2021
Indium Corporation ’s Kim Flanagan , Technical Support Engineer, will host an InSIDER Series webinar on reflow fundamentals in two sessions on Wednesday, Feb. 10 at 9 a.m. Eastern Time (2 p.m. British Time) and Tuesday, Feb. 16 at 9 a.m. Eastern Time (2 p.m. British Time). Soldering defects in SMT can arise from three main areas: design, materials, and process. Identifying the root cause and troubleshooting defects can be timely and expensive. There can be many ways to resolve one solder issue and, oftentimes, the easiest and least expensive way to resolve one of these soldering defects is by adjusting the reflow process. However, in order to understand how to best optimize the reflow profile, it is crucial to understand the basics behind the solder materials. During the two sessions of