Unmanned aerial vehicles (UAVs) are rapidly swarming modern battlespaces, growing in number as they shrink in size. They are meeting strict guidelines for reduced size, weight, and power (SWaP) even as their capabilities increase, packing payloads that include offensive ordnance, transmitters, receivers, cameras, and sensors. Miniaturization contributes not only to added functionality but to longer flight times and ranges on a battery. Advancing UAV technology for the battlefield presents the ongoing challenge of developing electronic payloads that are smaller and with wider bandwidths to support multiple sensors without delays. What once was a complete electronic warfare (EW) system carried by a large ground vehicle must now fit within a flight-ready vehicle that, in some cases, can be launched by hand. Fortunately, by fitting multifunction circuitry within a single multipin package, in the form of system-on-chip (SoC) or system-in-package (SiP) devices, versatile payloads ca
The technological evolution of the datacentre has been addressed by Imec’s Joris Van Campenhout. “Over the past decade, the consecutive introduction of
/PRNewswire/ 6G, compared to its predecessor, is expected to offer significantly better communication capabilities, such as Tbps-level peak data rates,.
/PRNewswire/ IDTechEx s new "Automotive Semiconductors 2023-2033" report provides a deep dive into the existing and emerging semiconductor technologies used.