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New Electronics - Siemens delivers 3D verification workflow for fan-out wafer-level packaging

Siemens Digital Industries Software has collaborated with the Outsourced Assembly and Test (OSAT) company Siliconware Precision Industries (SPIL) in the development and implementation of a new 3D verification workflow.

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Siemens to develop 3D verification for fan-out wafer-level packaging

Siemens to develop 3D verification for fan-out wafer-level packaging
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