Siemens Digital Industries Software, in collaboration with semiconductor foundry United Microelectronics (UMC), has developed and implemented a new multi-chip 3D integrated circuit (IC) planning, assembly validation and parasitic extraction (PEX) workflow for UMC’s wafer-on-wafer and chip-on-wafer technologies.
Siemens Collaborates with UMC to Develop 3D Integrated Circuit Hybrid Bonding Workflow iconnect007.com - get the latest breaking news, showbiz & celebrity photos, sport news & rumours, viral videos and top stories from iconnect007.com Daily Mail and Mail on Sunday newspapers.
Siemens Digital Industries Software has used the TSMC 2022 Technology Symposium to announce that its ongoing collaboration with TSMC has resulted in new product certifications for several of Siemens’ most advanced toolsets.