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Continental says automotive electronics to take up 45% of vehicle costs in 2035

Continental says automotive electronics to take up 45% of vehicle costs in 2035
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Prashanth doreswamySensors forumSemicon taiwanContinental automotive components

EV Group Hybrid Bonding and Nanoimprint Lithography Solutions to be Highlighted at Semicon Taiwan 2023

EV Group today announced that new developments in 3D/heterogeneous integration and augmented reality waveguide manufacturing enabled by its advanced wafer-to-wafer and die-to-wafer hybrid bonding, metrology, and nanoimprint lithography (NIL) solutions will be highlighted next week at the SEMICON Taiwan 2023 expo in Taipei, Taiwan.

Hualian xianT ai peiLaura thomsonPaul lindnerThomas uhrmannJason liSensors forumEv groupTechnology developmentTaipei nangang exhibition centerA holistic view ic forumHeterogeneous integration solutionsNanoimprint lithographyMeta lensesGeneration logicMemory manufacturing

SEMICON Taiwan 2022 Opens with Spotlight on Advanced Manufacturing

SEMICON Taiwan 2022 Opens with Spotlight on Advanced Manufacturing
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T ai peiTien wuLianjiang xianHualian xianHalli taiDonghui luMing hsin kungTerry tsaoDoris hsuSemiconductor sustainability summitTalent developmentSemiconductor engineeringMetrology forumSemiconductor sustainabilityWorkforce developmentTesting forum

SEMICON Taiwan 2022 to Highlight Auto Chips, Advanced Manufacturing, Heterogeneous Integration and Sustainability

SEMICON Taiwan 2022 to Highlight Auto Chips, Advanced Manufacturing, Heterogeneous Integration and Sustainability
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