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CERN Announces Thematic CERN School of Computing 2022: Scientific Software for Heterogeneous Architectures

Dec. 6, 2021 The 10th Thematic CERN School of Computing (tCSC 2022) will take place on May 1-7, 2022. The program will focus on Scientific Software for

Two years and $33M in, Land Information NZ delivers new services

These Are the Technical Skills You Need To Land a Job in 2021

These Are the Technical Skills You Need To Land a Job in 2021
gobankingrates.com - get the latest breaking news, showbiz & celebrity photos, sport news & rumours, viral videos and top stories from gobankingrates.com Daily Mail and Mail on Sunday newspapers.

ESSS and Ansys Significantly Boost Product Quality with Powerful Particle Modeling Workflow

ESSS and Ansys Significantly Boost Product Quality with Powerful Particle Modeling Workflow Ansys next-gen high-fidelity simulation solution speeds product design by 20-90x News provided by Share this article / Key Highlights Optimizing packaging of potato chips using Ansys Rocky ESSS and Ansys are delivering a discrete element modeling (DEM) workflow to overcome particle movement design issues for many industrial applications The new tool enables customers to simulate product performance across thousands of real-world operating scenarios ESSS and Ansys (NASDAQ: ANSS) are collaborating to provide an improved discrete element modeling (DEM) workflow for quickly analyzing and assessing particle movement across numerous industrial applications. Interoperable with industry-leading Ansys flagship solvers, the workflow helps engineers design highly reliable products, slash development time and win the race to market.  

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