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Hong Kong: Tech chief attends Berlin summit

SEMI 3D & Systems Summit to Spotlight Latest Trends in Heterogeneous Integration, Hybrid Bonding, Chiplet Design And Photonics

SEMI 3D & Systems Summit to Spotlight Latest Trends in Heterogeneous Integration, Hybrid Bonding, Chiplet Design And Photonics
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The Ecosystem: EU Chips Act starts to shape innovation landscape

With legislative work on the EU Chips Act making slow but steady progress, research organisations are starting to come forward with projects that meet its goal of developing the European ecosystem for semiconductor start-ups and scale-ups. The latest to unveil plans are the Research Fab Microelectronics Germany and a group led by VTT Technical Research Centre of Finland and Aalto University.

Isotope-controlled silicon carbide for solid-state quantum devices

At Fraunhofer IISB, a research group is developing optimized base materials and process technologies for solid-state quantum electronics using silicon carbide (SiC). The starting point are SiC layers epitaxially deposited on SiC wafers with precisely defined concentrations for the silicon and carbon isotopes.

Technic Joins MATQu Project

Technic Joins MATQu Project
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