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Leak suggests that Huawei could launch new MateBooks powered by AMD s Ryzen 5000 series of processors soon
New Ryzen 5000 series-powerd Huawei MateBooks could be launched soon (image via Weibo)
A well-known Weibo leaker says that Huawei will reportedly refresh its MateBook lineup with AMD Ryzen 5000 series mobile processors soon. They could arrive as early as March 2021, as Huawei is no longer allowed to purchase Intel chips.
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Even though Huawei announced its newest line of Intel Tiger Lake-powered laptops a few days ago, actually delivering upon the promise could be tricky. The U.S. government has revoked Intel s license to sell processors to Huawei, severely jeopardizing its ability to manufacture Intel-powered notebooks in the future. However, AMD seems to be unaffected at the moment. We could see AMD Ryzen 5000 series-powered MateBooks soon if a new leak is to be believed.
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The device could be announced by the end of this year.
The 13-inch variant is also rumoured to be powered by AMD Microsoft is reportedly working on two new Surface devices
Microsoft is reportedly working on two new Surface devices, Surface Laptop 4 and Surface Pro 8. A report indicates that the Surface Laptop 4 could be powered by an AMD Ryzen CPU.
In 2019, Microsoft had launched two versions of the Surface Laptop 3; One with a 13-inch display and the other with a 15-inch display. This is the first time the Redmond-based tech giant has used AMD CPUs for their Surface Laptop lineup with the modified versions of the AMD Ryzen 5 3500U.
Jan 6, 2021 16:26 EST
The first die block diagram of AMD s Ryzen 5000 Cezanne CPUs based on the Zen 3 architecture has been leaked by Videocardz. The block diagram shows that AMD s Ryzen 5000 Cezanne APUs will be sporting some major design changes and are not just a general refresh of the existing 3rd Gen Ryzen 4000 Renoir APUs.
AMD Ryzen 5000 Cezanne CPU Die Block Diagram Leaks Out, Much Bigger Than Ryzen 4000 Renoir Thanks To Zen 3 & Larger Cache
AMD s Ryzen 5000 Cezanne CPUs will be based on the Zen 3 core architecture which brings huge gains in IPC and efficiency. It is based on an optimized TSMC 7nm process node but the key Zen 3 changes have mainly been the restructuring of the cache design along with integral core upgrades.
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