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U S Innovation Competitiveness Summit

U S Innovation Competitiveness Summit
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U S Innovation and Competition Act aims to make bold $52B investment in semiconductor manufacturing sites like STAMP

Press release: Standing with Rochester Finger Lakes Region business and economic development leaders on Wednesday, U.S. Senate Majority Leader Charles E. Schumer re-upped his push for the Senate to pass his bold, bipartisan initiative next week to propel American leadership in science and technology into the 21st century. The legislation is in the debate process on the floor

Schumer Introduces Legislation To Invest $53 Billion In Domestic Semiconductor Industry, Fuel American Innovation

File photo of U.S. Senator Charles Schumer (2010). WASHINGTON, DC – Yesterday, U.S. Senate Majority Leader Charles E. Schumer filed the bipartisan U.S. Innovation and Competition Act, which combines Schumer’s Endless Frontier Act, other bipartisan competitiveness bills, and $52 billion in emergency supplemental appropriations to implement the semiconductor-related manufacturing and R&D programs authorized in last year’s National Defense Authorization Act and a program to support legacy chip production that is essential to the auto industry, the military, and other critical industries. An additional $1.5 billion is provided for implementation of implement the USA Telecommunications Act that was also passed as part of last year’s NDAA to foster U.S. innovation in the race for 5G. This package of innovation bills will receive a final Senate vote in the days ahead.

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