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Advanced Packaging Materials for Semiconductor Chips

Advanced semiconductor packaging evolves with chips and 3D integration, enhancing performance and thermal management for next-gen electronics.

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New Electronics - Marvell demonstrates 3nm data infrastructure silicon

Marvell Technology has demonstrated high-speed, ultra-high bandwidth silicon interconnects produced on Taiwan Semiconductor Manufacturing Company’s (TSMC) 3-nanometer (3nm) process.

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Marvell demo-es 3nm interconnect ICs

Marvell has demo-ed silicon interconnects produced on TSMC’s 3nm process. Marvell’s 3nm silicon building blocks include 112G XSR SerDes Long Reach SerDes,

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Marvell Demonstrates Industry s First 3nm Data Infrastructure Silicon

Marvell Demonstrates Industry s First 3nm Data Infrastructure Silicon
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Advanced Packaging Market Will Hit Big Revenues In Future | Samsung Electronics, Amkor Technology, Qualcomm Technologies

Advanced Packaging Market Will Hit Big Revenues In Future | Samsung Electronics, Amkor Technology, Qualcomm Technologies

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