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Gov Holcomb, IEDC announce generational

Gov Holcomb, IEDC announce generational
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SK hynix Signs Investment Agreement of Advanced Chip Packaging with Indiana

SK hynix Signs Investment Agreement of Advanced Chip Packaging with Indiana
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SK hynix announces semiconductor advanced packaging investment in Purdue Research Park

SK hynix announces semiconductor advanced packaging investment in Purdue Research Park
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Purdue universityUnited statesSouth koreaWest lafayetteTony roswarskiBrian edelmanMitch danielsMark lundstromMichael berghoffMung chiangSue ellspermannArati prabhakarEric holcombRichard michalTodd youngMitchelle daniels jr

Purdue Research Foundation: SK hynix announces semiconductor advanced packaging investment in Purdue Research Park

Purdue Research Foundation: SK hynix announces semiconductor advanced packaging investment in Purdue Research Park
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United statesWest lafayettePurdue universityBrian edelmanTodd youngArati prabhakarMung chiangDennis riedlEric holcombTony roswarskiMitchelle daniels jrSue ellspermannTim dotyRichard michalErin easterMitch daniels

SK hynix announces semiconductor advanced packaging

The company s facility for AI memory chips marks the largest single economic development in the history of the state.

United statesWest lafayettePurdue universitySouth koreaErin easterSue ellspermannTodd youngGregory deasonKwak noh jungArati prabhakarBrian edelmanMitch danielsMitchelle daniels jrMichael berghoffMung chiangTim doty