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Global Pipeline Intelligent Pigging Market 2021: SWOT Analysis of Key Driving Factors for Growing CAGR Value | Reports Globe – KSU

AIStorm s AI-in-Imager Solutions Use Tower Semiconductor s Hi-K VIA Capacitor Memory To Enable High-Density Imager, Always-On Processing

Press release content from Business Wire. The AP news staff was not involved in its creation. AIStorm’s AI-in-Imager Solutions Use Tower Semiconductor’s Hi-K VIA Capacitor Memory To Enable High-Density Imager, Always-On Processing May 6, 2021 GMT HOUSTON & MIGDAL HAEMEK, Israel (BUSINESS WIRE) May 6, 2021 AIStorm and Tower Semiconductor announced that AIStorm’s new AI-in-imager products will feature AIStorm’s electron multiplication architecture and Tower’s Hi-K VIA capacitor memory, instead of digital calculations, to perform AI computation at the pixel level. This saves on the silicon real estate, multiple die packaging costs, and power required by competing digital systems and eliminates the need for input digitization. The Hi-K VIA capacitors reside in the metal layers, allowing the AI to be built directly into the pixel matrix without any compromise on pixel density or size.

AIStorm s AI-in-Imager Solutions Use Tower Semiconductor s Hi-K VIA Capacitor Memory

Press release content from Globe Newswire. The AP news staff was not involved in its creation. AIStorm’s AI-in-Imager Solutions Use Tower Semiconductor’s Hi-K VIA Capacitor Memory . Tower SemiconductorMay 6, 2021 GMT AIStorm’s charge domain AI-in-Sensor technology uses Tower Semiconductor’s Hi-K VIA capacitor memory to enable best-in-class real-time machine learning for the $7B edge imager market. HOUSTON, Tx. and Migdal HaEmek, Israel May 6, 2021 AIStorm and Tower Semiconductor today announced that AIStorm’s new AI-in-Imager products will use AIStorm’s electron multiplication architecture and Tower’s Hi-K VIA capacitor memory instead of digital calculations to perform AI computation at the pixel level. This saves the silicon real estate, multiple die packaging costs and power required of competitive digital systems including eliminating the need for input digitization. The Hi-K via capacitors reside in the metal layers and thus allow the AI to be built directly i

Tower Semiconductor Announces a Webinar on Automotive Excellence

Share: best-in-class analog technology automotive solutions MIGDAL HAEMEK, Israel, March 9, 2021 –Tower Semiconductor (NASDAQ/TASE: TSEM), the leader in high-value analog semiconductor foundry solutions, today announced it will hold an online webinar on March 24, 2021, titled Automotive Excellence – From Design to Volume Production . The webinar will present the Company s automotive foundry program that spans across industry-leading analog technology platforms including RF, high-performance analog, power management and sensor, as well as its best-in-class design enablement capabilities that support the automotive market s rapidly evolving needs. In this webinar, Tower will present its full-circle Automotive Quality Program with its zero-defect methodology that support the rigorous automotive industry requirements for quality and reliability.  The webinar will also provide an overview of Tower s world-class design enablement capabilities for design of robust automotive pro

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