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Heraeus Electronics Provides Latest Materials Portfolio for Next-Generation Power Electronics and Semiconductor Advanced Packaging at NEPCON Japan 2023

Heraeus Electronics returns to NEPCON Japan after two years of the pandemic. At the exhibition, which is scheduled to take place January 25-27, 2023, at The Tokyo Big Sight, Heraeus Electronics will bring a wide range of innovative materials to enhance power module and semiconductor device performance.

Japan
Tokyo
Megan-craig
Semiconductors-industry
Heraeus-electronics
Ic-sensor-packaging-technology-expo
Tokyo-big-sight
Die-top-system
Powercu-soft
Silicon-carbide
Gallium-nitride
Industry-focus

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