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Samsung Electro-Mechanics, LG Innotek showcase latest chip substrates at KPCA
Korea s two major printed circuit board (PCB) makers are expected to showcase their latest products at an industry exhibition in Incheon this week.
Inch on gwangyoksi
South korea
Songdo convensia
Kim eung soo
Jeong cheol dong
Samsung packaging solution department
Samsung electro mechanics
Flip chip ball
Package substrates
Substrate zone
Tape substrate zone
Packaging solution department
Lg innotek
Samsung electro mechanics
South korea
He korea times
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